Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455211 | Integrated fan-out structure with openings in buffer layer | Wu Sen Chiu, Po-Hao Tsai, Jing-Cheng Lin | 2016-09-27 |
| 9425121 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Jui-Pin Hung, Jing-Cheng Lin | 2016-08-23 |
| 9378982 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jing-Cheng Lin, Jui-Pin Hung | 2016-06-28 |