Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406650 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Hung-Jung Tu, Shih-Hui Wang | 2016-08-02 |
| 9390949 | Wafer debonding and cleaning apparatus and method of use | Wen-Chih Chiou, Hung-Jung Tu | 2016-07-12 |
| 9299594 | Substrate bonding system and method of modifying the same | Weng-Jin Wu, Jing-Cheng Lin | 2016-03-29 |
| 9231502 | Motor control system and fan apply thereto | Kuan-Ting Lee, Ming-Yen Lin, Wen-Chih Wang | 2016-01-05 |