Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406650 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Yu-Liang Lin, Shih-Hui Wang | 2016-08-02 |
| 9390949 | Wafer debonding and cleaning apparatus and method of use | Wen-Chih Chiou, Yu-Liang Lin | 2016-07-12 |
| 9305769 | Thin wafer handling method | Chen-Hua Yu, Wen-Chih Chiou, Shin-Puu Jeng | 2016-04-05 |