Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9448585 | Clamping structure, electronic device and clamping component | Jui-Kai Cheng, Ju-Ching Lin, Ya-Jiun Tzeng, Chu-Ting Yang | 2016-09-20 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2016-08-16 |
| 9373755 | Light-emitting diodes on concave texture substrate | Chen-Hua Yu, Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen | 2016-06-21 |
| 9305864 | Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit | Jaw-Juinn Horng, Chung-Hui Chen, Der-Chyang Yeh, Yung-Chow Peng | 2016-04-05 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Jui-Pin Hung, Chien Ling Hwang | 2016-03-15 |