Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514986 | Device with capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2016-12-06 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2016-08-16 |
| 9263382 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Yi-Hsiu Chen, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |