Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425126 | Dummy structure for chip-on-wafer-on-substrate | Pei-Ching Kuo, Jun-Lin Yeh, Yung-Chi Lin, Li-Han Hsu, Wei-Cheng Wu +2 more | 2016-08-23 |
| 9418933 | Through-substrate via formation with improved topography control | Yung-Chi Lin, Ku-Feng Yang, Wen-Chih Chiou | 2016-08-16 |
| 9263382 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |