Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514986 | Device with capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Yin Chen, Ebin Liao, Ku-Feng Yang +1 more | 2016-12-06 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2016-09-20 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2016-08-16 |
| 9373575 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Jing-Cheng Lin | 2016-06-21 |
| 9263382 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Yi-Hsiu Chen, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2016-02-02 |
| 9240349 | Interconnect structures for substrate | Chen-Hua Yu, Wen-Chih Chiou, Shin-Puu Jeng | 2016-01-19 |