Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514986 | Device with capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Ebin Liao, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2016-12-06 |
YC
Yin Chen
Overall (2016): #177,674 of 481,213Top 40%
1
Patents 2016