Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2016-09-20 |
| 9269677 | Fabrication method of packaging substrate | Yu-Ching Liu, Yueh-Chiung Chang, Yu-Po Wang | 2016-02-23 |