Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9356008 | Semiconductor package and fabrication method thereof | Cheng-Chia Chiang, Hsin-Ta Lin, Fu-Tang Huang, Lung-Yuan Wang, Chu-Chi Hsu +1 more | 2016-05-31 |
| 9269677 | Fabrication method of packaging substrate | Chia-Yin Chen, Yu-Ching Liu, Yueh-Chiung Chang | 2016-02-23 |