Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524944 | Method for fabricating package structure | Chun-Wei Yeh, Chun-Hsien Shen, Hsiu-Jung Li, Ya-Yi Lai | 2016-12-20 |
| 9520351 | Packaging substrate and package structure | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu | 2016-12-13 |
| 9362245 | Package structure and fabrication method thereof | Chun-Wei Yeh, Chun-Hsien Shen, Hsiu-Jung Li, Ya-Yi Lai | 2016-06-07 |
| 9356008 | Semiconductor package and fabrication method thereof | Cheng-Chia Chiang, Hsin-Ta Lin, Yu-Po Wang, Lung-Yuan Wang, Chu-Chi Hsu +1 more | 2016-05-31 |
| 9324585 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu | 2016-04-26 |