Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520351 | Packaging substrate and package structure | Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang | 2016-12-13 |
| 9368467 | Substrate structure and semiconductor package using the same | Ho-Yi Tsai, Chin-Tsai Yao | 2016-06-14 |