Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520351 | Packaging substrate and package structure | Chang-Fu Lin, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang | 2016-12-13 |
| 9425152 | Method for fabricating EMI shielding package structure | Chien-Ping Huang, Chun-Chi Ke | 2016-08-23 |
| 9368467 | Substrate structure and semiconductor package using the same | Chang-Fu Lin, Ho-Yi Tsai | 2016-06-14 |