Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425152 | Method for fabricating EMI shielding package structure | Chin-Tsai Yao, Chien-Ping Huang | 2016-08-23 |
| 9254994 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao | 2016-02-09 |