Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520304 | Semiconductor package and fabrication method thereof | Hong-Da Chang, Yi-Che Lai, Shih-Kuang Chiu | 2016-12-13 |
| 9254994 | Package structure having MEMS element | Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2016-02-09 |