Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520304 | Semiconductor package and fabrication method thereof | Yi-Che Lai, Chi-Hsin Chiu, Shih-Kuang Chiu | 2016-12-13 |
| 9502335 | Package structure and method for fabricating the same | Chieh-Lung Lai, Hsien-Wen Chen, Mao-Hua Yeh | 2016-11-22 |
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hsin-Yi Liao, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |
| 9425119 | Package structure and fabrication method thereof | Shih-Kuang Chiu | 2016-08-23 |