Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520304 | Semiconductor package and fabrication method thereof | Hong-Da Chang, Yi-Che Lai, Chi-Hsin Chiu | 2016-12-13 |
| 9502333 | Semiconductor device having conductive vias | Meng-Tsung Lee, Yi-Che Lai | 2016-11-22 |
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Hsin-Yi Liao, Chun-An Huang, Chien-An Chen | 2016-11-08 |
| 9425119 | Package structure and fabrication method thereof | Hong-Da Chang | 2016-08-23 |
| 9324585 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Fu-Tang Huang | 2016-04-26 |