Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Hsin-Yi Liao, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Hsin-Yi Liao, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |