Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |
| 9254994 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Chun-Chi Ke | 2016-02-09 |