Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520304 | Semiconductor package and fabrication method thereof | Hong-Da Chang, Chi-Hsin Chiu, Shih-Kuang Chiu | 2016-12-13 |
| 9502333 | Semiconductor device having conductive vias | Meng-Tsung Lee, Shih-Kuang Chiu | 2016-11-22 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin | 2016-08-16 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Chien-Feng Chan, Mu-Hsuan Chan, Chun-Tang Lin | 2016-05-24 |
| 9324582 | Semiconductor package and fabrication method thereof | Chun-Tang Lin | 2016-04-26 |
| 9269693 | Fabrication method of semiconductor package | Chien-Feng Chan, Chun-Tang Lin | 2016-02-23 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Chian Liao | 2016-02-09 |