Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Mu-Hsuan Chan, Chun-Tang Lin, Yi-Che Lai | 2016-05-24 |
| 9269693 | Fabrication method of semiconductor package | Chun-Tang Lin, Yi-Che Lai | 2016-02-23 |