Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515040 | Package structure and fabrication method thereof | Yan-Heng Chen, Chieh-Yuan Chi, Chun-Tang Lin | 2016-12-06 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Yi-Chian Liao, Chun-Tang Lin, Yi-Che Lai | 2016-08-16 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Chien-Feng Chan, Chun-Tang Lin, Yi-Che Lai | 2016-05-24 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi, Yan-Yi Liao | 2016-05-10 |