Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515040 | Package structure and fabrication method thereof | Yan-Heng Chen, Mu-Hsuan Chan, Chun-Tang Lin | 2016-12-06 |
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Hsi-Chang Hsu | 2016-07-19 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan, Yan-Yi Liao | 2016-05-10 |