Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi | 2016-07-19 |