Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Hung-Wen Liu, Chieh-Yuan Chi, Hsi-Chang Hsu | 2016-07-19 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan, Chieh-Yuan Chi | 2016-05-10 |