Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515040 | Package structure and fabrication method thereof | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi | 2016-12-06 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Mu-Hsuan Chan, Yi-Chian Liao, Yi-Che Lai | 2016-08-16 |
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi, Hsi-Chang Hsu | 2016-07-19 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Chien-Feng Chan, Mu-Hsuan Chan, Yi-Che Lai | 2016-05-24 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi, Yan-Yi Liao | 2016-05-10 |
| 9324582 | Semiconductor package and fabrication method thereof | Yi-Che Lai | 2016-04-26 |
| 9269693 | Fabrication method of semiconductor package | Chien-Feng Chan, Yi-Che Lai | 2016-02-23 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Kuan-Wei Chuang, Yi-Chian Liao, Yi-Che Lai | 2016-02-09 |