Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Mu-Hsuan Chan, Chun-Tang Lin, Yi-Che Lai | 2016-08-16 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Che Lai | 2016-02-09 |