Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515039 | Substrate structure with first and second conductive bumps having different widths | Lu-Yi Chen, Yu-Chuan Chen, Chang-Lun Lu | 2016-12-06 |
| 9502335 | Package structure and method for fabricating the same | Hsien-Wen Chen, Hong-Da Chang, Mao-Hua Yeh | 2016-11-22 |