Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515039 | Substrate structure with first and second conductive bumps having different widths | Chieh-Lung Lai, Yu-Chuan Chen, Chang-Lun Lu | 2016-12-06 |
| 9269602 | Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate | — | 2016-02-23 |