Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515039 | Substrate structure with first and second conductive bumps having different widths | Chieh-Lung Lai, Lu-Yi Chen, Yu-Chuan Chen | 2016-12-06 |
| 9263380 | Semiconductor interposer and package structure having the same | Jyun-Ling Tsai | 2016-02-16 |