Issued Patents 2016
Showing 51–61 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299680 | Integrated circuit structure having dies with connectors | Cheng-Lin Huang | 2016-03-29 |
| 9299594 | Substrate bonding system and method of modifying the same | Yu-Liang Lin, Weng-Jin Wu | 2016-03-29 |
| 9293366 | Through-substrate vias with improved connections | Ku-Feng Yang | 2016-03-22 |
| 9293369 | Three-dimensional integrated circuit (3DIC) | Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2016-03-22 |
| 9287172 | Interposer-on-glass package method | Chen-Hua Yu | 2016-03-15 |
| 9281297 | Solution for reducing poor contact in info packages | Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2016-03-08 |
| 9252065 | Mechanisms for forming package structure | Po-Hao Tsai | 2016-02-02 |
| 9245773 | Semiconductor device packaging methods and structures thereof | Szu-Wei Lu, I-Hsuan Peng | 2016-01-26 |
| 9236369 | Bonded semiconductor structures | — | 2016-01-12 |
| 9230934 | Surface treatment in electroless process for adhesion enhancement | Cheng-Lin Huang, Wei-An Tsao | 2016-01-05 |
| 9230902 | Interconnect structure for wafer level package | Chen-Hua Yu, Nai-Wei Liu, Jui-Pin Hung, Shin-Puu Jeng | 2016-01-05 |