Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460987 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2016-10-04 |
| 9379069 | Semiconductor arrangement comprising transmission line surrounded by magnetic layer | Huan-Neng Chen, Jun-De Jin, Chewn-Pu Jou | 2016-06-28 |
| 9275923 | Band pass filter for 2.5D/3D integrated circuit applications | Feng-Wei Kuo, Huan-Neng Chen, Chewn-Pu Jou, Der-Chyang Yeh | 2016-03-01 |
| 9245833 | Metal pads with openings in integrated circuits | Yu-Ting Huang | 2016-01-26 |