Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385080 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu +1 more | 2016-07-05 |
| 9349699 | Front side copper post joint structure for temporary bond in TSV application | Ching-Wen Hsiao, Kuo-Ching Hsu, Chen-Shien Chen | 2016-05-24 |
| 9287153 | Semiconductor baking apparatus and operation method thereof | Hsin-Kai Chen, Hung-Chih Wang, Shih-Chi Lin | 2016-03-15 |