HP

Hsin-Yu Pan

TSMC: 1 patents #1,374 of 2,623Top 55%
Overall (2016): #376,850 of 481,213Top 80%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9502383 3D integrated circuit package processing with panel type lid Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang 2016-11-22