Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang | 2016-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang | 2016-11-22 |