Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496249 | 3DIC package and methods of forming the same | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2016-11-15 |
| 9385095 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung | 2016-07-05 |
| 9379036 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2016-06-28 |
| 9269694 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2016-02-23 |