Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397137 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Chien-Hsun Lee, Mirng-Ji Lii | 2016-07-19 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng | 2016-06-07 |