Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496189 | Stacked semiconductor devices and methods of forming same | Chen-Hua Yu, Tsung-Ding Wang, Jung Wei Cheng | 2016-11-15 |
| 9455236 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Tsung-Ding Wang, Jung Wei Cheng | 2016-09-27 |
| 9437551 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Tsung-Ding Wang | 2016-09-06 |
| 9397137 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Mirng-Ji Lii | 2016-07-19 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9343433 | Packages with stacked dies and methods of forming the same | Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-17 |
| 9337135 | Pop joint through interposer | Mirng-Ji Lii, Yu-Min Liang, Jiun Yi Wu | 2016-05-10 |
| 9318465 | Methods for forming a semiconductor device package | Jung Wei Cheng, Tsung-Ding Wang, Chun-Chih Chuang | 2016-04-19 |