Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460977 | Package-on-Package with via on pad connections | — | 2016-10-04 |
| 9418928 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2016-08-16 |
| 9385097 | Bump-on-trace methods and structures in packaging | — | 2016-07-05 |
| 9337135 | Pop joint through interposer | Mirng-Ji Lii, Chien-Hsun Lee, Yu-Min Liang | 2016-05-10 |
| 9287245 | Contoured package-on-package joint | — | 2016-03-15 |
| 9275967 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2016-03-01 |
| 9275964 | Substrate contact opening | Chen-Hua Yu | 2016-03-01 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu | 2016-02-16 |