Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9403254 | Methods for real-time error detection in CMP processing | James Jeng-Jyi Hwang, Chi-Ming Yang, Chin-Hsiang Lin | 2016-08-02 |
| 9406632 | Semiconductor package including a substrate with a stepped sidewall structure | Tsung-Ding Wang, Jung Wei Cheng | 2016-08-02 |
| 9275924 | Semiconductor package having a recess filled with a molding compound | Tsung-Ding Wang, Jung Wei Cheng | 2016-03-01 |
| 9242342 | Manufacture and method of making the same | Huang Soon Kang, Chi-Ming Yang, Chin-Hsiang Lin | 2016-01-26 |