HT

Hua-Wei Tseng

TSMC: 1 patents #1,374 of 2,623Top 55%
📍 New Taipei, TW: #797 of 2,260 inventorsTop 40%
Overall (2016): #375,753 of 481,213Top 80%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9406629 Semiconductor package structure and manufacturing method thereof Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more 2016-08-02