Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472521 | Scheme for connector site spacing and resulting structures | Yao-Chun Chuang, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-10-18 |
| 9406629 | Semiconductor package structure and manufacturing method thereof | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2016-08-02 |
| 9397059 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2016-07-19 |
| 9287191 | Semiconductor device package and method | Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-03-15 |
| 9287234 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2016-03-15 |
| 9257412 | Stress reduction apparatus | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-02-09 |