Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496233 | Interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-15 |
| 9484317 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-01 |
| 9449941 | Connecting function chips to a package to form package-on-package | Pei-Chun Tsai, Ching-Wen Hsiao, Tin-Hao Kuo, Chen-Shien Chen, Chung-Shi Liu +2 more | 2016-09-20 |
| 9425136 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Yao-Chun Chuang | 2016-08-23 |
| 9287234 | Dummy flip chip bumps for reducing stress | Tin-Hao Kuo, Chita Chuang, Chen-Shien Chen | 2016-03-15 |
| 9269688 | Bump-on-trace design for enlarge bump-to-trace distance | Tin-Hao Kuo, Chen-Shien Chen | 2016-02-23 |