Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508637 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2016-11-29 |
| 9496233 | Interconnection structure and method of forming same | Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-15 |
| 9431351 | Semiconductor package and manufacturing method of the same | Guan-Yu Chen, Tin-Hao Kuo, Chen-Shien Chen | 2016-08-30 |
| 9425117 | Substrate design with balanced metal and solder resist density | Guan-Yu Chen, Yu-Min Liang, Tin-Hao Kuo, Chen-Shien Chen | 2016-08-23 |
| 9236877 | Micro-electro-mechanical systems (MEMS), systems, and operating methods thereof | Yung-Chow Peng, Wen-Hung Huang | 2016-01-12 |