Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520379 | Method of forming bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2016-12-13 |
| 9508668 | Conductive contacts having varying widths and method of manufacturing same | Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-29 |
| 9484317 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2016-11-01 |
| 9435847 | Method for testing special pattern and probe card defect in wafer testing | Shih-Hsien Chang, Kai-Wen Tu, Ching-Ren Cheng | 2016-09-06 |
| 9379151 | Image sensor device with white pixel improvement | Chia-Yu Wei, Yin-Chen Chen, Yung-Lung Hsu, Hsin-Chi Chen | 2016-06-28 |
| 9318458 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2016-04-19 |