Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520379 | Method of forming bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2016-12-13 |
| 9425180 | Treating copper surfaces for packaging | Tin-Hao Kuo | 2016-08-23 |
| 9318458 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2016-04-19 |
| 9257385 | Landing areas of bonding structures | Tin-Hao Kuo, Chen-Shien Chen | 2016-02-09 |