MC

Ming-Hong Cha

TSMC: 1 patents #1,374 of 2,623Top 55%
📍 Baoshan, TW: #165 of 483 inventorsTop 35%
Overall (2016): #293,537 of 481,213Top 65%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9397059 Bonded structures for package and substrate Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more 2016-07-19