Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379299 | LED device with improved thermal performance | Hsing-Kuo Hsia, Chih-Kuang Yu, Hung-Yi Kuo | 2016-06-28 |
| 9349712 | Doubled substrate multi-junction light emitting diode array structure | Chih-Kuang Yu | 2016-05-24 |
| 9324624 | Optimizing light extraction efficiency for an LED wafer | Hsin-Hsien Wu, Yung-Hsin Yang, Ching-Hua Chiu | 2016-04-26 |
| 9324910 | Light emitting diode | Hsin-Hsien Wu, Chun-Lin Chang, Ching-Wen Hsiao, Kuang-Huan Hsu | 2016-04-26 |
| 9287478 | Method and apparatus for accurate die-to-wafer bonding | Hsin-Hsien Wu, Chih-Kuang Yu, Hung-Yi Kuo | 2016-03-15 |