Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502627 | Wafer level photonic devices dies structure and method of making the same | Hung-Yi Kuo | 2016-11-22 |
| 9472714 | Dicing-free LED fabrication | Hsing-Kuo Hsia, Gordon Kuo | 2016-10-18 |
| 9379299 | LED device with improved thermal performance | Hsing-Kuo Hsia, Hung-Yi Kuo, Chyi Shyuan Chern | 2016-06-28 |
| 9349712 | Doubled substrate multi-junction light emitting diode array structure | Chyi Shyuan Chern | 2016-05-24 |
| 9287478 | Method and apparatus for accurate die-to-wafer bonding | Chyi Shyuan Chern, Hsin-Hsien Wu, Hung-Yi Kuo | 2016-03-15 |