Issued Patents 2016
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9423837 | Portable electronic apparatus | Yi-Ta Huang, Wen-Chieh Tai, Cheng-Nan Ling | 2016-08-23 |
| 9425112 | Calibration kits for RF passive devices | Jie Chen, Hao-Yi Tsai, Hung-Yi Kuo | 2016-08-23 |
| 9418952 | Packaging devices and methods of manufacture thereof | Jie Chen | 2016-08-16 |
| 9406596 | Molding compound structure | — | 2016-08-02 |
| 9406739 | Inductor system and method | Hao-Yi Tsai, Hung-Yi Kuo, Tsung-Yuan Yu | 2016-08-02 |
| 9406631 | Semiconductor chip having different conductive pad widths and method of making layout for same | — | 2016-08-02 |
| 9401308 | Packaging devices, methods of manufacture thereof, and packaging methods | Tsung-Yuan Yu | 2016-07-26 |
| 9397060 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Kai-Chiang Wu | 2016-07-19 |
| 9396973 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Wen-Hsiung Lu, Hung-Jen Lin | 2016-07-19 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2016-07-12 |
| 9391028 | Integrated circuit dies having alignment marks and methods of forming same | Ying-Ju Chen | 2016-07-12 |
| 9385076 | Semiconductor device with bump structure on an interconncet structure | Yi-Wen Wu, Wen-Hsiung Lu | 2016-07-05 |
| 9379075 | Semiconductor device with bump stop structure | Jie Chen | 2016-06-28 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2016-06-28 |
| 9373599 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang | 2016-06-21 |
| 9368417 | Contact test structure and method | Jie Chen, Tsung-Yuan Yu, Ying-Ju Chen | 2016-06-14 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-05-31 |
| 9355979 | Alignment structures and methods of forming same | Ching-Jung Yang | 2016-05-31 |
| 9355978 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-31 |
| 9355906 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2016-05-31 |
| 9349665 | Methods and apparatus of packaging of semiconductor devices | Tsung-Yuan Yu, Jie Chen, Ying-Ju Chen | 2016-05-24 |
| 9349655 | Method for mechanical stress enhancement in semiconductor devices | Carlos H. Diaz, Yi-Ming Sheu, Anson Wang, Kong-Beng Thei, Sheng-Chen Chung +3 more | 2016-05-24 |
| 9343434 | Laser marking in packages | — | 2016-05-17 |
| 9343417 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2016-05-17 |
| 9337133 | Passivation scheme | — | 2016-05-10 |