Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520385 | Package structure and method for forming same | Hsien-Wei Chen | 2016-12-13 |
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Po-Yao Lin, Cheng-Yi Hong, Ming-Chih Yew | 2016-11-22 |
| 9502387 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2016-11-22 |
| 9453877 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2016-09-27 |
| 9341671 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2016-05-17 |
| 9252076 | 3D packages and methods for forming the same | Ming-Chih Yew, Wen-Yi Lin, Fu-Jen Li, Po-Yao Lin | 2016-02-02 |
| 9237647 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2016-01-12 |